Lithography Process Control by Harry J. Levinson

By Harry J. Levinson

Covers lithography method keep watch over at a number of degrees, from basic via complex themes. Self-contained instructional works either as an creation to the expertise and as a reference for the skilled lithographer. reports the rules of statistical approach regulate as historical past for complex issues corresponding to complicated techniques and feedback.


- Preface
- creation to using statistical method keep an eye on in lithography
- Sampling
- uncomplicated and intricate processes
- Linewidth control
- Overlay
- Yield
- strategy waft and automated technique control
- Metrology
- keep watch over of operations

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8 C. Takemoto, D. Ziger, W. Connor, and R. Distasio, "Resist Tracking: A Lithographic Diagnostic Tool," SPIE Vol. 1464, pp. 206 — 214 (1991). 9 10 M. A. van den Brink, C. G. M. de Mol, H. F. D. Linders, and S. Wittekoek, "Matching Management of Multiple Wafer Steppers Using a Stable Standard and a Matching Simulator," SPIE Vol. 1087, pp. 218 — 232 (1989). 45. org/terms SIMPLE AND COMPLEX PROCESSES 55 " K. Kemp, C. King, W. Wu, and C. Stager, "A "Golden Standard" Wafer Design for Optical Stepper Characterization," SPIE Vol.

6. Note that the metric Cpm is smaller than CPk for the same process, when there is a mean shift, since the Cp Z index emphasizes shifts of the process mean. 6. Process capability indices for the processes shown in Fig. 13. Process capability is a very powerful management and engineering tool. With a single number, one is able to assess the extent to which a process can meet the needs of the product. 0. As the processes mature, Cpm increases, as a consequence of process learning. However, in the ever-changing microelectronics industry, processes are usually rendered obsolete before manufacturing engineers have sufficient opportunity to bring them to full maturity.

23(3), pp. 213 —224 (1991). 2 3 C. Yu, T. Maung, C. Spanos, D. Boning, J. Cheung, H-Y Liu, K-J. Chang, and D. Bartelink, "Use of Short-Loop Electrical Measurements for Yield Improvement," IEEE Trans. Semicond. , Vol. 8(2), pp. 150 — 159 (1995). 45. org/terms SAMPLING 41 R. C. Elliott, R. R. Hershey, and K. G. Kemp, "Cycle-time Reduction of CD Targeting using Automatic Metrology and Analysis," SPIE Vol. 2439, pp. 70-77(1995). 4 G. E. P. Box, G. M. Jenkins, and G. C. Reinsel, Time Series Analysis, 3rd Edition, Prentice Hall, Englewood Cliffs, NJ (1994).

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