Fabless Semiconductor Implementation by Rakesh Kumar

By Rakesh Kumar

Detect the way to release and be successful as a Fabless Semiconductor Firm
Fabless Semiconductor Implementation takes you step by step in the course of the demanding situations confronted via fabless businesses within the improvement of built-in circuits. This specialist advisor examines the capability pitfalls of IC implementation within the swiftly starting to be fabless section of the semiconductor and elaborates the best way to triumph over those problems. It offers a complete evaluation of the problems that executives and technical execs stumble upon at fabless companies.
Filled with over one hundred fifty on-target illustrations, this business-building instrument offers a transparent photo of the full lifecycle of a fabless firm, describing the best way to envision and execute fabless IC implementation.
Inside This finished advisor to Fabless IC Design
- outline and specify the product comprehend the buyer standards, the worth chain, and the provision chain decide upon definitely the right implementation process, together with “make” vs. “buy” pick out the easiest applied sciences and provide chain enforce IC layout, fabrication, and production construct the operations infrastructure to fulfill expense and caliber specifications Program-manage the disbursed provide chain

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Introduction of environmental friendly, “green” packages. • Continued enablement of IC performance improvement. 29 30 Chapter 1 In the operations area: • Improved and seamless tracking of and visibility into product flow in the supply chain. Most systems are web-based and provide customers easy access. • Rapid availability of reports on the material in process. • Minimal customer involvement in shipping, customs and other handling issues. 3 Key Points • The maturing semiconductor industry has been driven by Moore’s Law.

It is interesting, though, that the industry has continually outdone the predictions of minimum feature size reduction. For example, the 65 nm node was expected to be in production in 2010. It has actually been in production since 2006 at the leading fabs. 2 “Moore” and “More than Moore” As the industry drove to maintain the doubling of transistors per chip every two years in accordance with Gordon Moore’s prediction, chips with 10 million gates (40 million transistors) became a reality in the late 1990s.

A traditional “more Moore” approach would require modifying the baseline digital process to include the flash within the digital chip. This approach could be expensive because of increased wafer process steps, as well as a potentially lower yield risk. In such an example, SiP packaging usually offers a superior optimization of cost and functionality. For continuity I will maintain a silicon-scaling-centric theme throughout this book. There will, however be a discussion of some of these “More than Moore” alternatives in the context of packaging in Chap.

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